Washington, D.C. · Est. 2021 Project controls & construction IT CareersPartnersProgram RatesMedia512-908-5223Data date
Semiconductor · U.S. West

300mm Wafer Fab Cleanroom Fit-Out

A 300mm wafer fab cleanroom fit-out, scheduled backward from the first production tool on its pad.

Owner
Confidential
Region
U.S. West
Market
Semiconductor
Capital value
$1.3B
Size
180,000 SF cleanroom
Delivery
CM at-risk
Duration
34 months
Status
In progress · 2027
The challenge

What is at stake.

Tool move-in dates are set by the production ramp, and every cleanroom zone must be certified clean before tools arrive. Hookup of gases, chemicals, ultrapure water and exhaust has to follow, zone by zone. Hundreds of contractor schedules feed one owner date.

Schedule34 monthsIn progress · finish 2027
202520262027
Today
Start
2025
Planned finish
2027
Time elapsed
61%
Our approach

How we control it.

What our schedulers and cost engineers are doing on this project.

01

Zone-based IMS

The integrated schedule is organized by cleanroom zone, with certification, tool set and hookup milestones for each.

02

Contractor integration

Contractor XER files are checked against a 14-point health check every update before they roll into the IMS.

03

Tool readiness

Each tool's pad readiness, utility points and hookup are tracked, so tool vendors know exactly when they can start.

04

Risk to ramp

Monthly risk analysis gives P50 and P80 dates for first tool in and first wafer out.

Results

Where it stands.

$1.3BCapital under control
34Months on one IMS
180K SFCleanroom by zone
P80First tool date reported

A fab is finished one tool at a time. So we schedule it one tool at a time.

Lead scheduler, AdenTurton
Semiconductor

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